Core Tip: Understanding solder paste performance is the foundation for efforts to improve yield and reduce costs. Steps 1 and 2 benchmark the current function and yield performance of the solder paste and serve as a reliable engineering basis for future material research.
According to Xingke Hardware Network, if you plan to switch to an alternative solder paste component, it is recommended to use the following series of test items to ensure successful implementation.
Step one, benchmarking the current performance of the existing solder paste. Test the main functional characteristics that can affect the pass rate of visual and electrical first pass. In order to achieve repeatability and product neutralization, this test is best done offline on the test model. Functional tests include: printability, slump morphology, tack and tack life, weldability, residue levels, and cleanability (if applicable).
Step 2, benchmarking the current product and process yield of solder paste on products that may "challenges" the material, which may have a tighter pitch or a wider range of components than traditional product designs; and, choose one A product that has completed the prototype phase but is still in its early life. (This step will be repeated on the missing material in the third step, and repeated on products that may use the new solder paste). All duplicates in a set of benchmarks are documented in detail so that you can pinpoint what is attributable to solder paste performance. At this time, the amount and waste can also be recorded. If possible, the factory conditions at the time of the benchmark test, such as temperature, humidity, operator, board lot number, solder paste, and even components, should also be recorded. You should choose a "good" batch: a typical one in a manufacturing environment that is large enough to be statistically significant (eg, greater than 50 but less than 500). A detailed report of the test pass rate is obtained. Explain the special reasons for rework of components. Each event should find out the cause, such as insufficient solder, open circuit, tin bridge, tombstone, poor wetness, non-coplanar pins, component misalignment and component loss. Since the performance of current materials is measured by major functional tests and their yield loss, it is a good time to evaluate the relative importance of the solder paste for the main performance categories of user assembly. For example, if the inspection analysis indicates a higher percentage of missing components, then stickiness may be important. Similarly, if the inspection primarily finds insufficient solder and/or open circuit, the weldability needs to be increased. If it is found to collapse in step 1 (short circuit is the main rework project), it means looking for a material with little or no slump.
Step three. The testing of the new material is carried out in the same conditions and methods as those specified in the existing solder paste in the first step. The results were then evaluated and all materials that performed worse were excluded. In fact, you should be aware of some balance in performance - applying the user settings expected from the performance of step two.
Step four. When it is possible to verify the increase in the yield and/or yield of new materials, the second batch of products should be produced - as close as possible to the same conditions as in step 2. If the situation is too different, the same amount of board should be produced with the existing solder paste. It is important to note all defects in order to accurately assess the effects of material changes.
Concerned about surprises
Label: Four-step test solder paste performance
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