Sensors and instrument components will become the focus of development

Sensors and instrument components are one of the most fundamental components of instrumentation and automation systems. Sensors and instrument components have the characteristics of wide service, variety and demand, and their technical level and product quality will lay the foundation for China's manufacturing informationization.

Status and problems

The technology and products of sensors and instrumentation in China have been greatly improved after development. There are more than 1,600 enterprises and institutions in the country engaged in the research, development and production of sensors and instrument components. However, compared with foreign countries, the product variety and quality level of China's sensors and instrument components can not meet the needs of the domestic market, and the overall level is still at the level of foreign countries in the early 1990s. The main problems are:

(1) The scientific and technological innovation is poor, the core manufacturing technology lags behind foreign countries seriously, the products with independent intellectual property rights are few, the varieties are incomplete, and the product technology level is about 15 years away from foreign countries.

(2) The investment intensity is low, the research equipment and production technology and equipment are backward, the level of achievement is low, and the product quality is poor.

(3) The disconnection between science and technology and production, affecting the transformation of scientific research results, the overall strength is low, and the stamina of industrial development is insufficient.

Strategic objectives

By 2020, the sensor and instrument components sector should strive to achieve three strategic goals:

--- Focus on industrial control, automotive, communication, and environmental protection. Focus on sensors, elastic components, optical components, and special circuits to develop original technologies and products with independent intellectual property rights;

--- Based on MEMS technology, relying on integrated, intelligent and networked technologies to strengthen the manufacturing process and the development of new sensors and instrument components, so that the leading products reach and close to the advanced level of similar foreign products;

--- To increase the variety, improve quality and economic benefits as the main goal, accelerate industrialization, so that the domestic sensor and instrument components share 70% to 80%, high-end products reach more than 60%.

Development focus

Sensor Technology

(1) MEMS process and next-generation solid-state sensor microstructure manufacturing process: deep reactive ion etching (DRIE) process or IGP process; packaging process: such as room temperature bonding flip-chip soldering, stress-free micro-thin structure packaging, multi-chip assembly process; New sensors: such as micro-silicon capacitive sensors, micro-silicon mass flow sensors, aerospace dynamic sensors, micro-sensors, automotive-specific pressure, acceleration sensors, environmentally friendly micro-chemical sensors.

(2) Integrated process and multi-variable composite sensor microstructure integration manufacturing process; multi-variable composite sensor for industrial control, such as: pressure, static pressure, temperature three-variable sensor, pressure, wind, temperature, humidity four-variable sensor, micro-silicon composite Strain pressure sensor, display sensor.

(3) Intelligent technology and intelligent sensor signal wired or wireless detection, transformation processing, logic judgment, function calculation, two-way communication, self-diagnosis and other intelligent technologies; intelligent multi-variable sensors, intelligent power sensors and various smart sensors, transmission Device.

(4) Networked technology and networked sensor sensor networking technology; networked sensors, the sensor has industrial standard interface and protocol functions.

Instrument components

(1) Development and improvement of elastic components: new electrodeposition process: electrodeposition molding process, welding molding process; focus on the development of low-rigidity, large-displacement, long-life micro-miniature precision bellows for aviation and aerospace, and bellows for high-temperature and high-pressure valves; Develop high-efficiency molding process equipment and performance testing instruments for bellows.

(2) Advanced technology for optical component development: aspheric optical component design, manufacturing technology, optical multilayer sputtering coating technology and new ion-assisted coating technology.

Development of new optical components for fiber optic communications and digital imaging, such as: miniature variable density filters, ultra-narrowband filters, microlens arrays, large area polarizing elements, aspherical glass-plastic hybrid lenses.

(3) Special circuit to improve the design technology and manufacturing process of dedicated circuit integration and personalized service;

Application software curing technology, develop special circuits for signal transformation, compensation, linearization, communication, network interface, etc. for intelligent, networked sensors and meters.

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