ZS-acid copper treatment agent (blue film remover) German technology, suitable for dye type copper copper brightener solution. Because it is not easy to find the abnormal phenomenon of acid copper plating, it appears blue fog phenomenon on the bright nickel coating. Actually it is acid copper fault. At this time, you can use the acid copper treatment agent (blue film agent) to process the solution. Select this product The solution is processed for ease of use, without stopping production and with immediate results.
Instructions
1. Add 0.05-0.1g/L, dissolve the powder with appropriate amount of distilled water and add it to the acid copper solution.
2. When adding this agent, it is found that when the luster of the acid copper plating is reduced or is not bright, the brightener in the bath is less, and it can be added and leveled again until the coating is bright.
3. Before using this agent, it should be applied to the large tank after the sample test, otherwise, excessive addition will make the brightener misaligned. Mechanism: The dye-like copper brightener has too many open-cylinder agents (C agents) and cannot be disposed of with ordinary chemicals. ZS removes the blue-film agent in order to make the coating bright without blue fog.
Attached: Causes and Solutions to Dye Copper Copper Brighteners (for reference)
The number of dye brighteners used in acid copper production is 210, 510, 910, and the number of brighteners, Leveler A, Brightener B, and Opener C.
Cause of malfunction Solution Brightness, leveling difference Brighteners A, B, C Improper Proportioning Supplementary bath temperature is too high (greater than 35°C) Cooling chloride ion Low hydrochloric acid (hydrochloric acid concentration 36%) Copper sulfate content is too low (low谟180g/L) Addition of copper sulphate to adjust high sulfuric acid (greater than 90g/L) Slow light emission, high burnability in large current area, poor leveling, low copper content, high leveling, low level of total concentration, low leveling, low chlorine content, low supplementation, poor dispersion of hydrochloric acid Brightener misadjustment: A agent is too much or too little, dark red at a small current, black and no light; no light at the hole and hook, "with glasses"; burned at high current; easy to produce hemp hole; brightener Less, high current is not coke, small current is not bright, plus C and B adjustment; A agent is more, at the same time, B, C are also more, treatment of B agent with hydrogen peroxide excess: high current is not charred; medium and small current is not bright plus A, or Add more A, add less CC agent excess: open a large current is not easy to scorch, add A agent to adjust the failure; start very slowly activated carbon treatment (hydrogen peroxide useless) linked to India A agent over-leveling (B, C) or hydrogen peroxide High temperature control for high temperature reduction of bath temperature, high level control, bright and smooth leveling (small current area is not easy to light), B too much chair A too much A less leveling pinhole, pitting A agent Multi-hydrogen peroxide treatment A agent Quality problems Purple suspended solids, filter A, B, C Balanced leveling Chlorine root Low-profile addition of tank solution to be heated and stirred, hydrogen peroxide, active light, sodium sulfide treatment Sulfuric acid content less The copper sulfate decreases rapidly, the anode passivation anode area is small, the anode anode current is excessively increased, the copper content in the anode bath is low, and the copper sulfate supplement is high (white ash is attached to the anode). Zinc powder treatment often occurs. Partial hangers are not lit, and even partially lit on the same rack may appear to be bipolar plated. Check for leakage. Anode is not conductive. Clean conductive orange peel, corrugation (bright yet acceptable, well dispersed) C high, A agent is also high, but not The pits appear to be leveled and the plating current is too high. The sponge-like scorch liquid is too cold and the current is too high. The thermostat is heated to about 10°C by using a quality heater; the appropriate wash water is too thin and the copper sulfate is too small. Analytical or experimental supplementation of anode and cathode distances to improve the equipment too close, widening plating tanks for unsuitable loading and unloading of workpieces, distance difference between the near and far anodes on the workpiece is too large. Cl- The test supplements chemical pure sodium chloride (40~50) mg/L. The voltage under the same current is 1 volt higher than the normal value. There is less sulfuric acid in the bath, so the conductivity is low and analysis of pure sulfuric acid makes the voltage drop to normal value ( The new dosing solution should be recorded.) The rectifier output DC circuit is poorly conducting. Check the connection points. Improve the current in the bad conductive areas and the voltage keeps rising. (The content of copper sulfate in the liquid keeps declining.) The anode is partially or completely passivated; Excessive use of phosphorus (0.03 ~ 0.06)% of low-phosphorus high-quality anode material anode area is too small: the anode itself is less than the anode after consumption is not added in time to increase the number of anodes in time to check the supplementary anode (too narrow or head mounted Continue to use in the titanium basket); If it is Yang basket plus phosphorus ball, block, should be enough to make up enough copper sulfate, liquid temperature is low when the crystallization and plug the anode bag hole (or mud plug hole) cleaning anode bag. If there is too much copper sulfate, dilute the plating solution, add sulfuric acid and other forest materials too little sulfuric acid, anode anodic dissolution test or analysis of additional sulfuric acid anode conductivity (no or little black phosphor film on the board) Parts, to ensure good conductivity Conductive plating rough plating solution is too dirty, too much mechanical impurities must be circulating filtration of the plating solution, when the filter table pressure is high, the filter element is cleaned in time, the surface of the substrate is well installed, and the surface of the substrate is poor, and the grinding and polishing is bad to strengthen the plating before plating. Pre-coating roughness Check the reason for pre-coating roughness, to eliminate dirty cleaning water before copper plating. Replace pre-plating cleaning water with complex parts in deep recesses or in the middle of large planar parts. Copper coating is generated, and even pre-plating is poor. Localized acid. Replacement of copper in the copper solution or corrosion of the substrate: Pre-plating layer is too thin to increase the pre-plating current, prolong the pre-plating time The pre-plating solution is too dirty, the pre-plating porosity high filtration pre-plating solution pre-coating liquid dispersing ability, deep plating power difference adjustment When the pre-plating solution is coated with copper, the workpiece is not timely charged. When the pre-plated copper layer is partially dissolved in copper, sufficient voltage must be applied first, and then the power is quickly loaded into the slot. The workpiece is badly mounted. The conductivity is not good. Check and correct to ensure good electrical conductivity. Integral work piece Brightness leveling Poor brightener Too little test Too much plating solution too thin Analytical or experimental adjustment Plating solution Current is too small, time is too short Improvement in operation Workpiece High current density area Brightness Leveling poor Too little copper sulfate and sulfuric acid Relatively There are few brighteners for multi-analysis or test supplementation, especially for B-agents with less Hall-grooves to compensate for deep parts of complex parts or middle parts of large planar parts (low current density areas). Addition of test and adjustment of brightener is too small, especially for small amount of agent A. Test of additional helium ions in the plating solution. Excessive dechlorination test. DC power waveform is bad: no low ripple DC power supply internal damage of DC power supply. Three-phase rectifier power supply After replacing the low-ripple DC power supply with an oscilloscope for confirmation, repair the power supply to find the cause and solve the problem of the workpiece. The light and the light are clearly demarcated. Excessive brighteners: Not adhered to less frequently added brightener. (Not diluted, not measured, caused by random messiness) The brightener must adhere to the principle of "difficulty plus little addition" and dilute 30% hydrogen peroxide 10 times with 1m l/L under constant stirring. Add slowly and stir for more than 10 minutes. Oxidation destroys some brightener bright nickel. The bright nickel bonding strength is not improved after copper plating. Addition of film removal process Chemical removal of film: The film is too thin and not fed in time. Except film time is too short, the workpiece is not oscillating, up and down, etc. The removal of the membrane fluid is too dirty, organic impurities are more timely in addition to the membrane replacement fluid to improve the addition of membrane operation to replace the membrane liquid copper used for a long time, organic impurities accumulated How much of the bright copper solution is treated: Add (5~8) ml/L of hydrogen peroxide, heat and stir for more than 8 hours (60°C), add analytically pure activated carbon (5~8) g/L, stir for 1 hour, and precipitate for 3 hours. Thoroughly filter the plating solution. After the test is dark copper, press the cylinder to add the opening agent. If activated carbon introduces too much chloride ion, then it will be treated with chlorine to remove blue fog or organic matter, and if B agent is excessively treated: A and the wetting agent will be easily adsorbed by the carbon powder. If 5g/l of activated carbon is added, it will be stirred vigorously, almost 100% % was cleared. B and MU (parts of MU) are hardly adsorbed by activated charcoal, and only a few hydrogen peroxide and activated carbon can be used. After nickel plating, there is an excess amount of blue hafnium copper photo-depositing agent. The blue layer is not visible in the copper layer, but it is reflected in the addition of a copper acid treatment agent on the bright nickel layer. The bright blue light is not fogged after nickel plating, and the anode surface of the brightener is properly added. A layer of black film or an off-white colloidal film of chloride ion concentration will appear