Abstract It is found that 0.1% of the boron nitride content of the thermal conductive filler in the polyhexamethylene adipamide (PA66) type thermal composite material is replaced by nano-diamond, and the thermal conductivity of the material is increased by about 25%. The Finnish Carbodeon company further improved the nano...
It has been found that the thermal conductivity of the material increases by about 25% after replacing 0.1% of the amount of boron nitride in the thermally conductive filler in the polyhexamethylene adipamide (PA66) type thermal composite with nanodiamond. By further improving the performance of nanodiamonds and polymers, Finland's Carbodeon not only maintains the original thermal conductivity of the material, but also reduces the consumption of nanodiamonds in the production process by as much as 70%, greatly reducing production costs. This new type of thermal composite material was developed by the Finnish VTT Technology Research Center and verified by the German 3M company.
Vesa Myllymäki, CTO of Carbodeon, said that in order to improve the performance of existing thermal materials, we make full use of the high thermal conductivity of diamond to further optimize nanodiamond fillers and other thermal conductive fillers, and finally solve the technical problem of easy agglomeration of nanodiamonds. .
The 4-6 nm diamond obtained by the detonation synthesis method is very suitable for the thermal conductive filler, but the active chemical composition inherent on the surface is easy to agglomerate and agglomerate, resulting in uneven distribution of the filler and a large amount of raw materials. By improving this active chemical composition, Carbodeon loosely separates the diamonds from each other and distributes them evenly over the parent material, especially the polymer.
For materials with higher thermal conductivity requirements, the thermal conductivity can be greatly improved and improved by filling 1.5% of the nano-diamond in every 20% of the thermally conductive filler.
The improved nano-diamond heat-conductive filler has no influence on the electrical insulation properties and other properties of the material, and does not cause tool wear, and is widely used in the fields of electronics and LED equipment.
Currently, Carbodeon focuses on the deep application of nanodiamonds in the field of polymer thermal conductive composites, metal grinding and industrial polymer coatings, and has obtained a patent in thermoplastic thermal conductive composite technology. (Chinese superhard material network translation: Wang Xian)
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